Demand for AI and high-performance computing is driving a sharp rise in chip power density in data centres, pushing heat flux beyond what conventional air and many liquid cooling approaches can handle. At the same time, operators and technology suppliers face increasing pressure to cut cooling overhead, simplify liquid-handling infrastructure, and respond to environmental and regulatory uncertainty around some dielectric fluids.
This whitepaper reviews the cooling landscape as it evolves from air to liquid and into two-phase approaches, including the practical limitations of immersion cooling and the promise of more localised two-phase sprays and jets. You’ll also learn how TTP’s proprietary technology can support next-generation chip-level thermal management, reducing system complexity and enabling scalable pathways to higher rack densities.
